Silicone Heat Transfer Compound
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Silicone Heat Transfer Compound
860
High thermal conductivity
High dielectric constant
High dissipation factor
Use with heat sinks or metal chassis
Will not dry or harden
Contains zincs oxides and polydimenthyl siloxane
Non-silicone
version available
Designed for use in transferring heat away from electrical and electronic devices such as;
transistors, power diodes, semi-conductors, ballast's and thermocouple wells. High
thermal conductivity, high dielectric constant, high dissipation factor, use with heat sinks
or metal chassis, will not dry or harden. Contains zinc oxide and polydimethyl siloxane.
Specifications
Physical Properties
Appearance
Consistency
Specific Gravity
@ 25°C (77°F)
Bleed %
24 hours @ 200°C
Evaporation
24 hours @ 200°C
Dropping Point
Min. operating temp.
Max. operating temp.
Electrical Properties
Thermal Conductivity
Dielectric Strength
(0.05l gap)
Dielectric Constant @
1000 Hz
Dissipation Factor
@ 1000 Hz
Resistivity @ 21°C
Test Method
Hot Wire Method
Heat Flow #36 °C
ASTM D-149
ASTM D- 150
ASTM D 150
ASTM D 150
FTM-321
FTM-321
ASTM D-566
Test Method
Visual
ASTM D 217
Non Silicone
8610
Off white /
smooth paste
310-320
2.5 min
1.0% max
2.0% max
> 500°F (260°C)
-40°F/-40°F
200°C
Non Silicone
8610
0.773 W/m•K
350 V/MIL
4.4
0.0021
6.38 x 10
13
Ohm•cm
2.3 min
2.0% max
2.0% max
> 500°F (260°C)
55°F/48°C
200°C (consistent)
300°C (intermittent)
Silicone
860
0.657 W/m•K
400 V/MIL
3.81
0.0032
1.5 x 10
15
Ohm•cm
Silicone
860
White paste
Available Sizes
Catalog Number
860-4G
860-60G
860-150G
860-1P
Sizes Available
4g x 100
60g (2 oz)
150g (5 oz)
1 pint (2.5 lbs)
Description
Pail of 100 singles
Jar
Tube
Tub
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4/28/2010
